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InSync, Inc.

Capabilities

Computer design through final polish, in one facility.

Every optic passes through computer design and finite element analysis, slicing, grinding, machining, etching, bonding, and polishing under one roof — verified against spec before it ships.

In the Shop

The equipment behind the spec.

Ultrasonic Impact Grinders

Ultrasonic Impact Grinders

Used to shape and rough-grind substrates to near-final form before fine grinding and polishing.

14 Foot (4.3 Meter) Diameter Polishing Machine

14 Foot (4.3 Meter) Diameter Polishing Machine

Our large-format polishing platform, built in-house to hold super-polished tolerances across large-aperture substrates.

Zygo Interferometer System

Zygo Interferometer System

Precision optical metrology used to verify surface figure and finish against spec before an optic ships.

Substrate Materials

  • Silicon
  • ULE™ Glass
  • Zerodur®
  • Nickel on GlidCop®
  • and others by request

Surface Shapes

  • Flats
  • Spheres
  • Sagittal Cylinders
  • Tangential Cylinders
  • Toroids
  • Conics

Proprietary Bonding

  • Si–SiSilicon to Silicon
  • Si–MSilicon to Metal
  • M–MMetal to Metal
  • and others by request